Working principle of vibrating screen

Sieving is the process of dividing the broken bulk materials with different particle sizes through the single-layer or multi-layer sieve surface with evenly distributed holes multiple times, and dividing them into several different levels. The particles larger than the sieve hole remain on the sieve surface, which is called the oversize of the sieve surface, and the particles smaller than the sieve hole pass through the sieve hole, called the undersize of the sieve surface. The actual screening process is: after a large number of broken materials with different particle sizes and mixed thickness enter the screen surface, only a part of the particles are in contact with the screen surface. Due to the vibration of the screen box, the material layer on the screen is loosened, so that the large particles already exist The gap in the gap is further expanded, and small particles take the opportunity to pass through the gap and transfer to the lower layer or the conveyor. Due to the small gap between the small particles, the large particles cannot pass through, so the particle groups that were originally arranged in disorder are separated, that is, they are layered according to the size of the particles, forming an arrangement rule that the small particles are at the bottom and the coarse particles are at the top. The fine particles that reach the sieve surface, those smaller than the sieve holes, pass through the sieve, and finally realize the separation of coarse and fine particles, and complete the screening process. However, there is no sufficient separation, and generally a part of the undersize remains in the oversize during sieving. When the fine particles pass through the sieve, although the particles are all smaller than the sieve holes, they have different degrees of difficulty in sieving. For particles with similar material and sieve hole sizes, it is more difficult to pass through the sieve, and it is even more difficult to pass through the particle gap in the lower layer of the sieve surface.